Acknowledgments

We would like to acknowledge the considerable contribution made to the project by the companies and organisations listed below, all of whom have participated in the creation of this resource, many making unpublished material available for our use. Please click on the logos in the table below for links to their web sites. If you wish to make contact with specific individuals within these companies in relation to this project, please get in touch with them through us by emailing thermal@electronics-ktn.com

Other visual material has been adapted from many different sources, and as far as possible we have attributed these on the slide(s) where they appear. Please advise us if we have inadvertently made use of images that are your copyright, and we will gladly add an acknowledgement.

 

The webcast collaborators

The list below, which is in alphabetical order, is of those who have contributed to the webcasts and similar presentations that are an integral part of this resource.

In most cases, the voice you will hear is that of the person who created the material. Many webcasts were specifically made for the project, but others were recorded at live events, which explains the variation in audio quality. We hope however that all will be intelligible. There is, in any case, a full transcript of the talk which can be viewed within Articulate, or printed from the associated “story board” link.

The biographical details in the table have been shortened, but appear in full in the webcasts that are linked below each entry – press the “Bio” button next to the picture in the webcast presentation. You can use the adjacent “Email” button to generate an email to the presenter.

	After studies in Berlin, Berkeley, Hamburg-Harburg and the University of Virginia, Thomas Ahrens started his industrial career at CEM Centrum für Mikroverbindungstechnik, Neumünster. Responsible since 1998 for the Quality and Reliability group in the Department of Module Integration at Fraunhofer Institute Siliziumtechnologie he has been transferring the results from applied research directly to the engineering and work floor level in electronics industries.
Heat Dissipation: presentation
	Lucius Akalanne is a thermal team leader responsible for thermal prediction, design and implementation of new solutions and technologies for a business unit in the UMTS wireless organisation. A Chartered Engineer with a PhD in fluid dynamics, Lucius has worked for Alcatel-Lucent for 10 years, and is a chairman of the company’s Thermal Council.
Thermal simulation vs thermal test results: webinar
	At the time this presentation was compiled, Masoud Ameli was a Research Engineer with Thermacore Europe. He has a BSc and MSc in Mechanical Engineering (1999) and was awarded a Master of Philosophy for research on the cooling of high power projector lamps by the University of Newcastle-upon-Tyne. Now his main research activities are focused on loop heat pipe and microchannel liquid cold plates.
Light and heat combined – Complexity in a small space: Case study
	Robin Bornoff received a BS. Hons in Mechanical Engineering and a PhD in the application of computational fluid dynamics from Brunel University. Robin has been with Mentor Graphics Mechanical Analysis Division since 1996, initially in the role of Consultant Engineer, then Senior Consultant Engineer, and now as Product Manager for the Electronics Cooling line of business.
PCB Thermal Simulation – The State of the Art: webinar
	Mike Firmstone has over 40 years experience in electronics packaging and interconnect covering components, devices, materials, processing and manufacturing. He spearheaded the development and introduction into Europe of thick film pastes, advanced adhesives, encapsulants and thermal management materials, and now runs TecKonnect International, a consultancy specialising in materials for electronics. .
Thermal Interface Materials: presentation
	Chris Hill has been employed in the electronics industry for 20 years in various roles, most recently, as an application engineer at NXP Semiconductors, where he has been heavily involved with the application of power semiconductors. Chris has an MSc in Electronic Product Design from the University of Bolton, where his final-year dissertation was on component-level thermal simulation. Significant extracts from Chris’s earlier work are quoted by Murray MacCallum in the case studies Comparing modelling methods and Modelling a small system.
How thermal design is tackled: Interview; Demonstration of tool operation
	Verdant Electronics founder and president Joseph (Joe) Fjelstad has more than 35 years of international experience in electronic interconnection and packaging and is a well-known author on these technologies. Joe was formerly with Tessera Technologies, where he was appointed to the first corporate fellowship for his innovations, and co-founded SiliconPipe, a leader in high-speed interconnection.
The Thermal Management Challenge: webinar
	Murray MacCallum is a senior lecturer at Edinburgh Napier University, where for over 20 years he has taught on courses from general electronics to more specialist subjects like PCB manufacture and CAD. Murray has designed and delivered a range of training courses for industry, concentrating mostly on electronics manufacture, and engaged in a number of consultancy projects..
Presenter on webcasts and case studies in section on Thermal Modelling
	John Parry has been with Flomerics since its inception in 1989, and is Research Manager in what is now the Mechanical Analysis Division of Mentor Graphics. John was involved in a number of major projects, Project Co-ordinator for DELPHI and SEED, and his technical contributions and publications include the development and application of thermal compact models.
Mesh Technologies  for  CFD: webinar
	Michael Stoll is the European Business Manager for IMS substrates. He started with Bergquist in 1996 and has now a more than 12 year experience within the thermal markets. The Bergquist Company is known as the thermal solution provider for Thermal Interface Materials and IMS metal core substrates.
Case study from EuroLED 2008
	Martin Tarr provides technical and marketing services to many companies in the electronics industry. His area of interest covers all aspects of interconnect technology from semiconductor back-end processes through to equipment practice. In 40 years in the electronics industry, Martin has learn the hard way how electronics manufacture works and how failures happen.
Responsible for editing contributions and for creating all the other webcasts…