Here we explain what is meant by “thermal modelling” at component, board and system level, and start exploring the concept of thermal resistance. If this is familiar to you, move on to the next section.

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In this section, the concept of thermal resistance is applied to real packages, and we have included a review of their main technologies, and the consequence of component packaging decisions for thermal performance. Then we look at how thermal parameters are measured, and how these relate to the models used in simulation. This is where you will find out about “detailed” models, and about the various types of compact model you may come across (two-resistor and DELPHI) and why this simplification is used.

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The main webcast compares the different level of modelling, and indicates the level of accuracy you might expect. In this short case study, we look at the results given by different thermal models for a plastic quad flat pack in a number of typical cooling environments.

Comparison of thermal models: Case study introduced by Murray MacCallum » Print of case study storyboard  »

 

What we are trying to achieve by thermal modelling is to reduce thermally-associated risk in real products by predicting their thermal behaviour. And real products contain many heat-generating elements, each of which needs to be considered and simulated. In the main webcast we are exploring different types of software tool, as well as making the point that using appropriate tools can be particularly effective when carried out early in the design process.

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The most complex simulation packages are not always required, depending on the application, and this case study looks at different approaches, including ThermXL and FloPCB, that can be used to evaluate a design and suggest and evaluate appropriate changes.

Comparing modelling methods: Case study introduced by Murray MacCallum » Print of case study storyboard  »

Semiconductors aren’t the only heat sources, and in this case study we see both calculation and simulation used to tackle a challenging application.

Light and heat combined – Complexity in a confined space: Case study by Masoud Ameli of Thermacore » Print of case study storyboard  »

Even where a simulation package is available, the designer still needs to approach its use in a structured way. In this case study we show how a simulation package was applied to model a small piece of telecommunications equipment.

Modelling a small system: Case study introduced by Murray MacCallum » Print of case study storyboard  »

 

The approach has to be structured, and an understanding of the basics is required, but how the tool works is relatively straightforward. At least it is straightforward in the hands of an expert! This demonstration shows how the sequence of processes involved in setting up and running a model.

Demonstration of tool operation by Chris Hill of NXP » Print of webcast storyboard  »

 

Whichever modelling methods or tools we use, the results that we get will only be predictions. To give ourselves and our colleagues confidence, we need to verify those predictions by measurement. The more experience we gain with the tools and the way that we can use them to produce accurate models, the more useful those tools will be in enabling us to modify and optimise our designs. And the more information we get, the better we can make our thermal model.

Note that this webcast is significantly longer than others (70 mins), in order to include a significant amount of useful detail, but you can use the navigation to move through topics more quickly. Also remember that you can listen just to part of any webcast and, when you return to it at a later time, your system will offer you the option of re-starting the presentation where you left off (unless you have disabled cookies).

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Lucius Akalane describes the work carried out on a typical project to compare the results of test with thermal simulation, and promotes simulation as a way of helping in the evolution of designs, by dealing with power dissipation during the design feasibility stage. [The sound-track is the best quality available from the original webcast]

Thermal simulation vs thermal test results: webinar given by Lucius Akalane of Alcatel-Lucent » Print of webinar storyboard  »

In the main webcast, we describe the methods by which tests are carried out to verify performance predictions. In this case study from ATS, a custom heat sink for a card in GE Fanuc’s Intelligent Platform is used to illustrate the development and verification process, and emphasises the product reliability improvement that can be achieved by correct cooling.

Case study: Thermal analysis, heat sink design and performance verification  »

Robin Bornoff discusses the ways in which thermal simulation is now able to use improved methods for modelling the fine detail of board assemblies.

PCB Thermal Simulation – The State of the Art: webinar given by Robin Bornoff of Flomerics » Print of webinar storyboard  »

A number of our webcasts make reference to the “grid” or “mesh” that we use to overlay our model of the product in order to make it possible to compute temperature and airflow. In this webinar, John Parry reviews how this process works, and the different types of mesh that can be used for effective modelling.

Mesh Technologies  for  CFD: webinar given by John Parry of Flomerics  » Print of webinar storyboard  »