Dealing with the heat
In the two parts of this short section, we are looking first at the mechanisms of heat generation within typical parts of the electronic structure, and then at how heat moves within the structures, and the rules that apply, which are all topics that you may find helpful in preparation for understanding Section 3’s discussion on modelling. As always, we will be focusing on the practicalities rather than too much heavy theory.
Each of the concertina sections below expands into a webcast, and the way in which these are presented allows you to see their structure, and move quickly to areas of particular interest. Or you can pause on any slide and look at it in detail, or read the transcript. [See this link for how to get the best from the Articulate Presenter format]
Mechanisms of heat generation
Electronic components and interconnects are far from perfect, which is why we need thermal management. In this webcast we are looking at the prime sources of heat in a typical circuit, and considering passive components as well as semiconductors, whilst not forgetting the losses within board and connections. Part of our discussion relates to the position of the sources of heat within components, and the factors that we have to take into account when developing a thermal model.
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Where heat goes
Having looked at where heat comes from, in this second short webcast we are focussing on the mechanisms by which heat is removed from the active areas to the surroundings. We are dealing with conduction, convection and radiation basics, and with the rules that apply and their implications for thermal design, before finally looking at general approaches for removing excess heat, a topic that we will deal with in detail in Section 4.
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